Electronic Packaging and Interconnection Materials Committee

JOM Topics

The following topics appear in recent issues of JOM under the sponsorship of our committee.

Topic Title: Localized Mechanical Property Assessment in Electronic Materials and Systems

Publication Date: May 2025

Topic Title: Advanced Interconnect and Packaging Technologies

Publication Date: June 2025

Past Topics

Topics no longer accepting submissions

Topic Title: Advanced Technology for Electronic Packaging and Interconnection Materials

Publication Date: June 2024

Topic Title: Advanced Technology for Electronic Packaging and Interconnection Materials

Publication Date: June 2023

Topic Title: Low-temperature Technology for Electronic Packaging and Interconnects

Publication Date: May 2022

Topic Title: Materials for High Reliability Devices

Publication Date: February 2021

Topic Title: Progress with Lead-Free Solders

Publication Date: February 2020

Topic Title: Advances in Electronic Interconnection Materials

Publication Date: January 2019

RESOURCES

Home Documents Committee Roster Technical Programming JOM Topics Contact Staff Liaison Doodle (Scheduling Tool)

Your TMS Communication Preferences

You may not have had a chance to update your society communications preferences yet. Please take a moment now and update your preferences. Opting-in to society communications ensures uninterrupted access to TMS society news - including event announcements, membership news, TMS studies and journals.

Please select one of the options below to confirm your communication preferences with TMS:

Yes, I would like to receive communications from TMS

No, I do not want to receive communications from TMS

Remind Me Later

Please note: TMS or third party vendors may use cookies, tags, and web beacons when you browse the TMS website. To learn more or update your settings, view the TMS Privacy Policy or contact privacy@tms.org.

Electronic Packaging and Interconnection Materials Committee

JOM Topics

Past Topics

Follow Us

About TMS